| 摘要 |
The invention concerns a method for making an electronic device such as a chip card, comprising at least a thin chip (1) designed to be made integral with a body (2). The invention is characterised in that it comprises a first step which consists in forming a micromodule (10) comprising said chip (1) made integral with a support and a second step which consists in transferring said micromodule onto the body (2) with an adhesive (52) inserted between at least a surface portion (1a) of the chip and a surface portion (50a) of the body (2). |
