| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing laminated ceramic electronic components with which faulty adhesion among a plurality of laminated green chip parts themselves can be reduced. SOLUTION: A laminated green block 12 is adhered to an adhesive sheet 18, and a plurality of cut grooves 17 are formed on the green block 12 with a prescribed pitch by two blades having a clearance therebetween, and then a piece of the green block pinched between the two blades is removed to form a plurality of laminated green chip parts 13, on the adhesive sheet 18 having a clearance between adjoining faces of the green chip parts 13. Thereafter, the green chip parts 13 are peeled off from the adhesive sheet 18.</p> |
