发明名称 |
STRESS REDUCTION FOR LEAD FRAME DURING PLASTIC SEALING |
摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a lead frame equipping structure in which a contact region between the lead frame mounting structure and an integrated circuit die and to obtain a designing method in which a stress generated by thermal expansion can be dispersed to a bigger region than the die between points with which the lead frame is contacted. SOLUTION: This method in which an integrated circuit die is mounted in a mounting structure contains a step of forming the mounting structure having a die pad and a spreader at least, a step of mounting a contact part on the die pad of the mounting structure and the one spreader at least and a step of the one spreader at least existing between the die pad and the integrated circuit die.</p> |
申请公布号 |
JP2001284516(A) |
申请公布日期 |
2001.10.12 |
申请号 |
JP20010073168 |
申请日期 |
2001.03.14 |
申请人 |
MICROCHIP TECHNOL INC |
发明人 |
FERNANDEZ JOSEPH;TERMER DAN;RICHARDSON DAVID ALAN |
分类号 |
H01L23/50;H01L21/52;H01L23/495;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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