CIRCUIT FORMATION METHOD AND PLASMA TREATMENT APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a circuit formation method which does not require a large- scale manufacturing apparatus including a vacuum chamber, whose production costs can be lowered and which is especially suitable for forming a circuit pattern to a three-dimensional structure and to provide a plasma treatment apparatus which is used suitably for the method. SOLUTION: A surface creepage plate 1 which is formed in such a way that a filamentary electrode 4 which is constituted of a plurality of electrode pieces 4a so as to be separated at prescribed intervals is laminated on a sheetlike electrode 2 via a dielectric layer 3 is used. While the filamentary electrode 4 is brought into contact with the circuit formation face of an insulating molded body 10, it is moved along the circuit pattern as a target. A voltage is applied across the filamentary electrode 4 and the sheetlike electrode 2. A region to which the filamentary electrode 4 on the insulating molded body 10 is moved is plasma-treated. A conductive material is stuck to the plasma- treated region by an electroless plating method.