| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck capable of reducing contamination produced on a semiconductor wafer, and improving chuck responsiveness and its manufacturing method. SOLUTION: The electrostatic chuck adheres a ceramic layer 103 on the disk of prescribed thickness through an adhesive layer on a disk-like metal board 101, and a high purity insulation material layer 105 is formed on the ceramic layer 103. |
