| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin-film pattern forming method using an adhesive sheet for peeling off a thin film, utilizable in methods of forming metal electrode patterns on a semiconductor substrate, etc., whereby a thin film pattern without contamination of adhesives, etc., can be formed surely. SOLUTION: In peeling off an adhesive sheet, an adhesive layer of this sheet is individualized about adhesion and set so as to separate the portions for peeling off a thin film from portions for not peeling it off, thus forming a desired pattern made of a thin film on a substrate.
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