| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that it is difficult to realize mass production when it is necessary to manufacture an IC card by supplying IC chips one by one on a substrate in the conventional manner. SOLUTION: A positioning jig which is provided with plural opening parts whose dimensions make it possible to house semiconductor elements is arranged on a substrate on which the semiconductor elements are loaded, and plural semiconductor elements are supplied on the jig so as to be housed in the opening parts and fixed on the substrate, and then the substrate is cut so that individual electronic device can be manufactured. In the case of the chip-shaped semiconductor elements, it is possible to easily handle the chins by mounting reinforcing members on the chips.</p> |
