发明名称 |
SEMICONDUCTOR MODULE FOR POWER |
摘要 |
PROBLEM TO BE SOLVED: To eliminate bad solder printing which is caused by slippage, in a process of separating a metal mask of solder printing in a conventional semiconductor module for power. SOLUTION: A pyrolytic mask is used in place of a metal mask, whereby a process of peeling off a mask is dispensed with to raise the yield in cream solder printing. |
申请公布号 |
JP2001284375(A) |
申请公布日期 |
2001.10.12 |
申请号 |
JP20000090015 |
申请日期 |
2000.03.29 |
申请人 |
SANSHA ELECTRIC MFG CO LTD |
发明人 |
OKAMOTO SHIGERU;TACHIBANA HIDEHISA;TANAKA SEIJI |
分类号 |
H01L25/07;H01L21/52;H01L25/18;(IPC1-7):H01L21/52 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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