| 摘要 |
<p>PROBLEM TO BE SOLVED: To facilitate the measurement of the surface resistance of a wafer cassette. SOLUTION: The wafer cassette to be tested 400 is installed on an electrode plate 110, wafer electrodes 121, 122 are installed in the prescribed cassette groove of the wafer cassette 400, and the wafer electrodes 121, 122 performing measurement by switches 131, 132 are selected. In a circuit formed to connect the selected wafer electrode 121 or 122, a direct current power source 140, the electrode plate 110, the wafer cassette 400, and resistance 150, current determined by the resistance value of the wafer cassette 400 connected to prescribed voltage supplied to the direct current power source, the electrode plate 110 and the wafer electrode 121 or 122, and resistance 150 for measurement 150 flows. The voltage across the resistance 150 is amplified by AMP 160, and transformed into the resistance value by a resistance value transformation means 170 to measure the resistance value. The resistance value is checked on whether it is in a predetermined range by a management means 180, and the result is displayed on a display 190 together with the measured values.</p> |
