发明名称 HEAT TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To enable to heat treat a material in a short time by setting the material on a conductive material, and by supplying electricity directly to the conductive material. SOLUTION: A housing hole 4 for the material, consisting of at least one concave hole or a through hole in the vicinity of the center B of plate-shaped body 2 made of conductive material, numerous micro-pores or grooves 6 in both outsides of the housing hole 4, and at least one groove or a hole 8 in further outside are equipped at a conductive plate jig A. The material to is set in the housing hole 4 for the material of the conductive plate jig A, and by supplying electricity and heating the conductive plate jig A, the material set in the housing hole 4 for the material of the conductive plate jig A can be heat-treated in a short time.
申请公布号 JP2001284033(A) 申请公布日期 2001.10.12
申请号 JP20000090916 申请日期 2000.03.29
申请人 AYUMI KOGYO KK 发明人 ABE TAIZO
分类号 H05B3/68;(IPC1-7):H05B3/68 主分类号 H05B3/68
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