| 发明名称 |
METHOD FOR FORMING METAL ELECTRODE PATTERN AND ADHESIVE SHEET FOR STRIPPING OFF METAL FILM |
| 摘要 |
PROBLEM TO BE SOLVED: To surely provide a method for forming a metal electrode pattern at the electrode part on a semiconductor substrate, by attaching an adhesive sheet for stripping off a metal film to the metal film provided on the surface of an insulating part and the electrode part formed on the semiconductor substrate, and then stripping off the metal film well form the surface of the insulating part. SOLUTION: The adhesive, composing the adhesive layer of an adhesive sheet for stripping off a metal film, has an acid value of 10 or higher.
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| 申请公布号 |
JP2001284385(A) |
申请公布日期 |
2001.10.12 |
| 申请号 |
JP20000097188 |
申请日期 |
2000.03.31 |
| 申请人 |
NITTO DENKO CORP;DENSO CORP |
发明人 |
TOYODA HIDESHI;NANZAKI YOSHIHIRO;NAMIKAWA AKIRA;TERADA YOSHIO;KONDO ICHIJI;MIYAJIMA TAKESHI |
| 分类号 |
H01L21/28;H01L21/3205;H01L21/60;H01L23/52;(IPC1-7):H01L21/60;H01L21/320 |
主分类号 |
H01L21/28 |
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