| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a film with a metal foil which is suitable for transferring and forming a wiring circuit on a ceramic wiring board and which reduces an irregularity in the contact property of a fired ceramic board with the wiring circuit. SOLUTION: The metal foil is bonded to the surface of a film base body composed of an organic resin or the like. A ceramic gel layer on which a ceramic sol such as an alumina sol, a silica sol or the like is dried or a ceramic thermally sprayed layer and a coating layer which is composed of at least one kind of a metal vapor-deposited layer selected from among a group of Al, Si, Ti and Nb are formed on the surface of the metal foil. The side of the metal foil on the film with the metal foil is compression-bonded to the surface of an unfired ceramic sheet which is composed of a mixture of a glass powder and a ceramic powder. The film base body is stripped together with an adhesive layer. The metal foil is transferred and formed on the surface of the ceramic sheet. The ceramic sheet is fired together with the metal foil.</p> |
