| 摘要 |
PROBLEM TO BE SOLVED: To make the developing capacity of a developer supplied onto a substrate uniform on the surface of the substrate. SOLUTION: The developer and a rinsing solution are simultaneously supplied onto a wafer W from a developer supply nozzle 40 and a rinsing solution supply nozzle 11 by moving the nozzles 40 and 11 while the wafer W is rotated. Since the nozzle 11 is positioned in the direction in which the rinsing solution dropped onto the wafer W is diffused, the diffused developer already used for development is immediately removed by the rinsing solution. Consequently, a new developer having a high developing power is supplied over the whole surface of the wafer W and, accordingly, no development blur occurs on the surface of the wafer W. |
