发明名称 LARGE CURRENT PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a large current printed wiring board whose contact resistance is small and work efficiency is good. SOLUTION: A first copper board 11, a second copper board 12, an insulating layer 13 surrounding the first copper board 11 and the second copper board 12, a first through hole 14 passing through the first copper board 11 and the insulating layer 13 positioned above and below the first copper board 11, a first conductor layer 14a which is formed on the inner face of the first through hole 14 and is electrically connected to the first copper board 11, a second through hole 15 passing through the second copper board 12 and the insulating layer 13 positioned above and below the second copper board 12, and a second conductor layer 15a which is formed on the inner face of the second through hole 15 and is electrically connected to the second cooper board 12, are installed.
申请公布号 JP2001284757(A) 申请公布日期 2001.10.12
申请号 JP20000159194 申请日期 2000.03.31
申请人 TOSHIBA CORP 发明人 OKANO FUMINORI
分类号 H05K1/11;H05K1/02;H05K1/18;(IPC1-7):H05K1/11 主分类号 H05K1/11
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