MOUNTING COMPONENT AND MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a mounting method in which a chip component is mounted surely on a board by using a conductive adhesive whose bonding strength is insufficient. SOLUTION: Electrodes 2 of the component 1 are bonded to lands 4 of the board 3 via the conductive adhesive C whose bonding strength is comparatively weak. The body part 1a of the component 1 is bonded to the non-land part of the board 3 via an insulating adhesive N whose bonding strength is comparatively strong. The hardening temperature of the insulating adhesive N is selected to be lower than that of the conductive adhesive C. The hardening shrinkage percentage of the insulating adhesive is selected to be higher than that of the conductive adhesive. Instead of a thermosetting adhesive, a photocuring adhesive is used as the insulating adhesive N whose bonding strength is comparatively strong.