| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive transmission line structure, which is composed of a platelike dielectric substrate without using a via hole, for efficiently transmitting signals while reducing reflections from low frequency to high frequency and a package for a high frequency semiconductor device. SOLUTION: In the transmission line structure embedded in the dielectric substrate to pass while detouring a metal wall body formed in the main side of this dielectric substrate, a strip line is formed orthogonally to the main side of the dielectric substrate. |
