发明名称 MOUNTING METHOD OF PRINTED WIRING BOARD FOR HIGH FREQUENCY, PRINTED WIRING BOARD MOUNTING MEMBER FOR HIGH FREQUENCY AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board mounting member for high frequency which can be manufactured without indispensability of high pressure and large-scale contact-bonding equipment, through hole formation after mounting on an object to be mounted and flatness of the object to be mounted, and to provide a manufacturing method of the mounting member. SOLUTION: This metal base unified printed wiring board as the printed wiring board mounting member for high frequency is manufactured by bonding a printed wiring board whose back has a mesh GND pattern on a metal base by using conductive adhesive agent, and consists of the printed wiring board 33, the metal base 31 and the conductive adhesive agent 32 which bonds the board 33 and the base 31 on an interface of them. A contact surface of the board 33 with the adhesive agent 32 has the mesh GND pattern 33a.
申请公布号 JP2001284803(A) 申请公布日期 2001.10.12
申请号 JP20000093510 申请日期 2000.03.30
申请人 NEC CORP 发明人 KUSAMITSU HIDEKI
分类号 H05K3/44;H01P1/30;H01P3/08;H05K1/02;H05K1/05 主分类号 H05K3/44
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