| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board capable of simultaneously realizing the high capacity of a built-in capacitor and the low inductance of power source wiring and ground wiring in the wiring board building in the capacitor inside of the board. SOLUTION: The wiring board 1 is provided with a first connection terminal 3P forming a dense area MR on the main face and a second connection terminal 3G. The inside is provided with a built-in capacitor 13 such as a power source electrode layer 29, a ground electrode layer 30 and a high dielectric layer 76. Connection wiring connecting each electrode layer and each connection terminal is collectively formed in a projection dense area TMR projecting the dense area in the thickness direction, and in addition, through holes 29K or the like for insulating each electrode layer and each connection terminal are collectively formed in the dense area.</p> |
