| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor wafer transfer apparatus where a semiconductor wafer can be sucked and fixed on a suction table side in a flat state when conveying the wafer among each process such as an alignment for positioning the wafer, a UV irradiation, a protective tape peel-off or the like, in a process for manufacturing the wafer. SOLUTION: This apparatus comprises a conveying arm 60 for sucking the semiconductor wafer W and conveying it between the suction tables, the conveying arm 60 comprising an suction part 62 for freely detachably sucking the semiconductor wafer W, and an outer periphery presser member 70 which abuts on the outer periphery of the semiconductor wafer and sucking and fitting the semiconductor wafer on the suction table side in the flat state when transferring the semiconductor wafer W sucked on the conveying arm 60 to the suction table.</p> |
