| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic bonding material for assuring connecting reliability, similar to that in conventional anisotropic conductive connection using a gold bump or a soldering bump, even if a relatively hard bump such as a nickel bump is used for a protruded electrode in anisotropic connection between an electronic element such as a bare IC chip with the protruded electrode and a connection pad for a wiring board. SOLUTION: For an anisotropic conductive bonding material having conductive particles dispersed in a thermosetting resin, a 10% compression bonding modulus of elasticity (E) of the conductive particles and a vertical modulus of elasticity (E') of the protruded electrode of the electronic element to be connected with the anisotropic conductive bonding material are satisfied with a relational expression, 0.02<=E/E'<=0.5. |
