| 摘要 |
PROBLEM TO BE SOLVED: To improve high frequency characteristics by reducing impedance between the ground electrode of a high frequency transistor and the real ground. SOLUTION: A first LC serial circuit composed of a bonding wire L8 for grounding and a capacitor C8 for grounding and a second LC serial circuit composed of a bonding wire L9 for grounding and a capacitor C9 for grounding are parallel connected to the source electrode of a high frequency transistor Q1. A third LC serial circuit composed of a bonding wire L10 for grounding and a capacitor C10 for grounding, a fourth LC serial circuit composed of a bonding wire L11 for grounding and a capacitor C11 for grounding,..., and sixth LC serial circuit composed of a bonding wire L13 for grounding and a capacitor C13 for grounding are parallel connected to the source electrode of a high frequency transistor Q2 and respectively grounded. |
