| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film electronic part and a board capable of improving the adhesion strength of a support board and an electrode layer. SOLUTION: The thin film electronic part is provided with a support board 1 and a thin film element A provided on the support board 1 and having an insulating layer 3 on the electrode layer 5. A number of voids 31 are formed in the electrode layer 5, and the inside of the voids 31 of the electrode layer 5 is filled with the insulating material of the insulating layer 3. |
