| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board with high adhesion between electric insulating layers and superior high-frequency characteristics (a low dielectric tangent). SOLUTION: This multilayer circuit board comprises an inner layer board which consists of an electric insulating layer (1) and a conductive material circuit (1) formed on the surface on the electric insulating layer, a primer layer formed on the inner layer board by a coupling agent, an electric insulating layer (2) which is made by curing a curable polymer composition containing an alicyclic olefin polymer or an aromatic polyether on the inner layer board, a multilayer circuit board which has a conductive material circuit (2) on the electric insulating layer (2) or an inner layer board which has an electric insulating layer (1) and an conductive material circuit (1) with surface roughness Ra of 0.1 through 400 nm formed on the surface of the electric insulating layer, the electric insulating layer (2) which is made by curing a curable polymer composition containing an alicyclic olefin polymer or an aromatic polyether on the inner layer board, and a conductive material circuit (2) on the insulating layer (2). |
