发明名称 CONDUCTIVE PASTE AND LAMINATED ELECTRONIC COMPONENT, AND THEIR MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste and laminated electronic components, and their manufacturing method, with which the deterioration of an insulation resistance can be suppressed, even when a dielectric layer is made thin. SOLUTION: This conductive paste is made mainly of Ni powder and desirably contains a Cr powder of 0.01 wt.% or less in all metallic elements, and a Co powder of 0.05 wt.% or less in all metallic elements.
申请公布号 JP2001284162(A) 申请公布日期 2001.10.12
申请号 JP20000096539 申请日期 2000.03.31
申请人 KYOCERA CORP 发明人 IWASAKI KENICHI
分类号 H01G4/12;H01B1/22;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
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