发明名称 POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION
摘要 <p>A positive photosensitive polyimide resin composition which can be developed with an aqueous alkali solution and is excellent in sensitivity and developability. It is characterized by comprising a solvent-soluble polyimide represented by the general formula (1), a carboxylic acid or carboxylic acid derivative, and a photosensitive o-quinonediazide compound. (In the formula, a, indicating the number of the repeating units, is an integer of 3 to 10,000; 1 to 100 mol% of R1s are accounted for by a divalent organic group having one or more groups which are at least one member selected from the group consisting of phenolic hydroxyl, carboxyl, thiophenol, and sulfo groups and 0 to 99 mol% thereof are accounted for by a divalent organic group containing none of phenolic hydroxyl, carboxyl, thiophenol, and sulfo groups; and R2 is a tetravalent organic group.)</p>
申请公布号 WO2001075525(P1) 申请公布日期 2001.10.11
申请号 JP2001002502 申请日期 2001.03.27
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