| 摘要 |
<p>An adhesive composition characterized in that it comprises (a) an epoxy resin, (b) a curing agent and (c) a high molecular weight compound having a weight average molecular weight of 100,000 or more, wherein, when A represents the total weight of the epoxy resin (a) and the curing agent (b) and B represents the weight of the high molecular weight compound (c), the ratio A/B is more than 1 and not more than 10; an adhesive composition characterized in that the components thereof are separated into a sea phase and island phases in a cross section after curing, wherein, when X represents the area of the sea phase and Y represents the area of the island phases, the ratio X/Y is 0.1 to 1.0; an adhesive film comprising any of the above adhesives formed into a film; an adhesive film for connecting a semiconductor chip with a substrate for carrying a semiconductor or with another semiconductor chip, characterized in that the adhesive film can fix them with a pressure of 0.01 to 0.5 MPa while heating; a substrate for carrying a semiconductor having the adhesive film on the surface thereof to carry a chip; and a semiconductor device which uses the adhesive film or the substrate for carrying a semiconductor.</p> |
