Arrangement of multi-chip sensor modules used in the production of moisture, gas and bio-sensors comprises a structured substrate with recesses

摘要

Arrangement of multi-chip sensor modules comprises a structured substrate (1) with recesses. At least one sensor chip (3) is fixed so that the sensor surfaces are upwardly exposed and contact pads applied to the sensor chips are covered by the substrate. Preferred Features: The substrate is made from silicon, ceramic or glass. The substrate is assembled in a frame system made from ceramic or glass. At least one signal processing chip (2) is located below the substrate per sensor module.