发明名称 Method for forming aluminum oxide as a gate dielectric
摘要 A method for forming a gate structure begins by preparing a semiconductor substrate provided with an isolation region formed therein. A thin SiO2 layer is thermally grown on top of the semiconductor device by using a wet H2/O2 or a dry O2. And then, an aluminum oxide layer is formed on top of the semiconductor substrate with doping a dopant in situ. A conductive layer is formed on top of the Al2O3 layer. Finally, the conductive layer and the Al2O3 layer are patterned into the gate structure. The dopant is a material selected from a group consisting of Si, Zr, Hf, Nb or the like.
申请公布号 US2001029092(A1) 申请公布日期 2001.10.11
申请号 US20000727583 申请日期 2000.12.04
申请人 PARK DAE-GYU;JANG SE-AUG;LEE JEONG-YOUB;CHO HUNG-JAE;KIM JUNG-HO 发明人 PARK DAE-GYU;JANG SE-AUG;LEE JEONG-YOUB;CHO HUNG-JAE;KIM JUNG-HO
分类号 H01L21/28;H01L21/3115;H01L21/316;H01L29/51;(IPC1-7):H01L21/320;H01L21/476 主分类号 H01L21/28
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