发明名称 Method for manufacturing master substrate used for manufacturing grooved molding substrate, method for manufacturing stamper for manufacturing grooved molding substrate, method for manufacturing grooved molding substrate, grooved molding substrate, memory medium, memory device, and computer
摘要 A substrate having a photoresist coated thereon is exposed to exposure light along a line through a lens 1. The exposure position is moved from the initial position O1 to a position O2 that is separated from the initial position by a distance corresponding to the sum of a groove width Gw and a land width Lw. The exposure is carried out along a line parallel to the initial exposure line. By repeating this, exposed areas having a width Lw and a separation Gw are formed on the photoresist. The photoresist is developed to remove the exposed areas of the photoresist. A resin or the like is pressed on it to form a replica. From the replica, a stamper is manufactured using an electroforming method. Finally, a grooved molding substrate is manufactured from a glass or resin using the stamper. Although the land width Lw is defined by the effective spot diameter phi of the optical system, the groove width Gw can be less than this value.
申请公布号 US2001028936(A1) 申请公布日期 2001.10.11
申请号 US20010772928 申请日期 2001.01.31
申请人 NISHIYAMA MADOKA;MORITA SEIJI 发明人 NISHIYAMA MADOKA;MORITA SEIJI
分类号 B29C33/38;B29C45/26;B29D17/00;C25D1/10;G11B5/82;G11B5/84;G11B7/24;G11B7/26;(IPC1-7):B29D11/00;C25D1/00;G11B3/70 主分类号 B29C33/38
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