| 摘要 |
Polishing pads, planarizing machines and methods for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays or other microelectronic substrate assemblies. One planarizing machine of the invention is a web-format machine having a planarizing table to support a portion of the polishing pad in a planarizing zone, at least one roller to hold another portion of the polishing pad, and a carrier assembly for handling a microelectronic substrate assembly. A web-format polishing pad used with this machine can include a body having a planarizing medium, an elongated first side edge, and an elongated second side edge opposite the first side edge. The body has a length sufficient to extend across the planarizing zone and wrap around the roller. The planarizing medium can have an elongated interior region extending lengthwise along the body, an elongated first side region extending lengthwise along the first side edge, and an elongated second side region extending lengthwise along the second side edge. The polishing pad can further include a first planarizing structure in the interior region that has a first planarizing aggressiveness, and a second planarizing structure in each of the side regions having a second planarizing aggressiveness. The second planarizing aggressiveness is less than the first planarizing aggressiveness.
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