ADHESIVE COMPOSITION, METHOD FOR PREPARING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR CARRYING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE

摘要

An adhesive composition characterized in that it comprises (a) an epoxy resin, (b) a curing agent and (c) a high molecular weight compound having a weight average molecular weight of 100,000 or more, wherein, when A represents the total weight of the epoxy resin (a) and the curing agent (b) and B represents the weight of the high molecular weight compound (c), the ratio A/B is more than 1 and not more than 10; an adhesive composition characterized in that the components thereof are separated into a sea phase and island phases in a cross section after curing, wherein, when X represents the area of the sea phase and Y represents the area of the island phases, the ratio X/Y is 0.1 to 1.0; an adhesive film comprising any of the above adhesives formed into a film; an adhesive film for connecting a semiconductor chip with a substrate for carrying a semiconductor or with another semiconductor chip, characterized in that the adhesive film can fix them with a pressure of 0.01 to 0.5 MPa while heating; a substrate for carrying a semiconductor having the adhesive film on the surface thereof to carry a chip; and a semiconductor device which uses the adhesive film or the substrate for carrying a semiconductor.