| 摘要 |
<p>A method of manufacturing a COF package comprises providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole and fixing it with its electrodes exposed at the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.</p> |
