| 摘要 |
<p>The invention provides a structure, in which an electronic device is mounted on a soldering layer (9) deposited over a pad (3) formed on a substrate (10). The pad (3) includes a base layer (4) and a first plating layer (5) formed on the base layer (4). The soldering layer (9) includes a layer (8) for preventing the diffusion of the metallic components of the base layer (4) into the solder.</p> |
