| 摘要 |
The device has at least one passive heat conducting element in contact with at least one heat transfer medium in a solid state. The heat transfer medium is a phase change material with a much higher heat absorption capacity than water in the form of a latent heat store. It stores heat generated by loading the electronic component that can no longer be absorbed by the passive cooling element until the electronic component loading is lower. The device has at least one passive heat conducting element (12). At least part of the element is in contact with at least one heat transfer medium (20) in a solid state. The heat transfer medium is a phase change material with a much higher heat absorption capacity than water in the form of a latent heat store. It stores heat generated by loading the electronic component that can no longer be absorbed by the passive cooling element and carried away, retaining its solid state, and gives the heat off again at a later time of lower loading of the electronic component. Independent claims are also included for the following: a processor with a cooling device and the use of a heat transfer medium for cooling microprocessors.
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