| 发明名称 |
Electrically insulating thin-film-forming resin composition and method for forming thin film therefrom |
| 摘要 |
An electrically insulating thin-film-forming resin composition comprising (A) a hydrogen silsesquioxane resin, (B) a solvent-soluble polymer, and (C) a solvent; and a method for forming an electrically insulting thin film therefrom.
|
| 申请公布号 |
US2001029283(A1) |
申请公布日期 |
2001.10.11 |
| 申请号 |
US20010765204 |
申请日期 |
2001.01.18 |
| 申请人 |
NAKAMURA TAKASHI;SAWA KIYOTAKA;KOBAYASHI AKIHIKO;MINE KATSUTOSHI |
发明人 |
NAKAMURA TAKASHI;SAWA KIYOTAKA;KOBAYASHI AKIHIKO;MINE KATSUTOSHI |
| 分类号 |
C08L45/00;C08L65/00;C08L83/04;C08L83/05;C08L101/00;C09D5/25;C09D145/00;C09D183/04;C09D183/05;H01B3/46;H01L21/312;(IPC1-7):C08L83/04;B05D3/06;B05D5/12;C08F8/00 |
主分类号 |
C08L45/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
