| 摘要 |
<p>A method of manufacturing a build-up wiring board is characterized in that a copper foil (41) having a semi-cured resin sheet (42) which is different from an insulating resin in the outermost layer of a core part is laminated as a first layer outside the core part which is manufactured by a press-laminating process and has a multilayer structure, the foil is formed into a prescribed circuit pattern (32), and application of an insulating resin (31) to the pattern and forming of the circuit pattern (32) are repeated at least once to manufacture a build-up laminated part (20).</p> |
