发明名称 Semiconductor device, method for fabricating the same and method for fabricating semiconductor substrate
摘要 A first semiconductor layer is epitaxially grown on a semiconductor substrate and patterned to form concave and convex portions. A second semiconductor layer is formed on the first semiconductor layer using a top epitaxial mask covering the top surface of the convex portion. Lattice defects D propagating from the first semiconductor layer exist only in a region located above the center of the concave portion (a defect region Ra), while in the other region (a low defect region Rb) lattice defects D propagating from the first semiconductor layer hardly exist.
申请公布号 US2001029086(A1) 申请公布日期 2001.10.11
申请号 US20010790908 申请日期 2001.02.23
申请人 OGAWA MASAHIRO;ORITA KENJI;ISHIDA MASAHIRO;NAKAMURA SHINJI;IMAFUJI OSAMU;YURI MASAAKI 发明人 OGAWA MASAHIRO;ORITA KENJI;ISHIDA MASAHIRO;NAKAMURA SHINJI;IMAFUJI OSAMU;YURI MASAAKI
分类号 H01L21/20;H01L33/00;(IPC1-7):H01L21/76 主分类号 H01L21/20
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