| 发明名称 |
MOUNTING STRUCTURE OF ELECTRONIC DEVICE AND METHOD OF MOUNTING ELECTRONIC DEVICE |
| 摘要 |
The invention provides a structure, in which an electronic device is mounted on a soldering layer (9) deposited over a pad (3) formed on a substrate (10). The pad (3) includes a base layer (4) and a first plating layer (5) formed on the base layer (4). The soldering layer (9) includes a layer (8) for preventing the diffusion of the metallic components of the base layer (4) into the solder. |
| 申请公布号 |
WO0176335(A1) |
申请公布日期 |
2001.10.11 |
| 申请号 |
WO2001JP02702 |
申请日期 |
2001.03.29 |
| 申请人 |
ROHM CO., LTD.;NAKAMURA, SATOSHI |
发明人 |
NAKAMURA, SATOSHI |
| 分类号 |
H01L23/492;H01L23/498;H05K3/24;H05K3/34;(IPC1-7):H05K3/34;B23K1/00;H01L21/60;B23K1/20 |
主分类号 |
H01L23/492 |
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