摘要 |
An in-mold decorating label, which comprises a thermoplastic resin film substrate layer (I) having provided on its backside a heat-sealable resin layer (II), the heat-sealable resin layer (II) containing a polyethylenic resin and at least one of (i) a fatty acid amide having a molecular weight of 300 or more and (ii) an organic or inorganic fine powder having an average particle size larger than thickness of the heat-sealable resin layer (II). This label for use in in-mold decorating has excellent feeding and discharging properties upon printing and workability during sheeting, which facilitates insertion of the label into a metal mold during in-mold decorating, and provides a label-laminated container which does not suffer from blister generation and has a large welding force between the container and the label.
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