Verfahren und Vorrichtung zum Verbinden mindestens eines Chips mit einer Umverdrahtungsanordnung

摘要

An electroconductive connection is created between a chip and a rewiring arrangement (6-10) which is set apart from said chip by spacers (5), by introducing an electroconductive contact material (14-16) into recesses (13) of the rewiring arrangement (6-10). This results in an efficient and mechanically very stable electrical connection between the chip pads and the rewiring planes.