| 发明名称 |
Poliermittel und Verfahren zur Herstellung planarer Schichten |
| 摘要 |
Slurries containing SiO2 are used as a polishing agent for planarizing silicon dioxide layers. It was found that slurries have a higher abrasion rate during the polishing of SiO2 layers if the silica sols used have a bimodal particle size distribution.
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| 申请公布号 |
DE10063870(A1) |
申请公布日期 |
2001.10.11 |
| 申请号 |
DE20001063870 |
申请日期 |
2000.12.21 |
| 申请人 |
BAYER AG |
发明人 |
VOGT, KRISTINA;PANTKE, DIETRICH;PUPPE, LOTHAR;KIRCHMEYER, STEPHAN |
| 分类号 |
C09G1/02;C09K3/14;H01L21/3105;(IPC1-7):C09G1/02;C30B33/00;H01L21/304 |
主分类号 |
C09G1/02 |
| 代理机构 |
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代理人 |
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