| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a apparatus for achieving the conformal, step coverage on a substrate by an ionized metal plasma deposition. SOLUTION: A target 104 provided a source of a material to be sputtered and ionized by the plasme generated by a coil 122. The ionized material is deposited on the substrate 110 biased to the negative voltage. A power source connected to the target varies by the modulated or time-fluctuated signal during the treatment. The modulated signal includes preferably a negative and positive voltage. The negative and positive voltage are switched alternately, and the sputtering step is repeated between in a center and in an edge. The quality and uniformity of the film can be controlled by adjusting the frequency and amplitude of the signal, the duration time of the positive signal, the power supplied to a supporting member 112 and a coil, and other process parameters.
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