| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive film that can be applied under a low bonding load and is free from bleeding of the adhesive from a through-hole without damaging low elasticity, heat resistance and moisture resistance required in attaching, on a wiring substrate referred to as an interposer such as a glass epoxy substrate, a flexible substrate, or the like, semiconductor chips having a large difference from the wiring substrate in thermal expansion coefficient, and provide a wiring substrate for mounting a semiconductor and a semiconductor device both provided with the adhesive film. SOLUTION: The adhesive film is formed by laminating two different adhesive layers: a first adhesive layer which comprises an adhesive comprising 100 pts.wt. epoxy resin with a curing agent for the epoxy resin, 10-100 pts.wt polymer component containing a functional group and having a weight average molecular weight of not less than 100,000 and a Tg of not less than -50 deg.C to not more than 0 deg.C and 0.1-20 pts.wt. curing accelerator and which has a curing degree in a range of 0-40% as measured by a differential scanning calorimeter(DSC) and a second adhesive layer which comprises an adhesive comprising the same composition as the first adhesive layer and which has a curing degree in the same range as that of the first adhesive layer, wherein the polymer component in the second adhesive layer has an amount of 10 pts.wt. or more than that of the polymer component in the first adhesive layer or the second adhesive layer has a curing degree of 5% or higher than that of the first adhesive layer as measured by DSC. The wiring substrate for mounting a semiconductor and the semiconductor device are fabricated by using the adhesive film.</p> |
