SEALING MATERIAL, SOLDERING FLUX, SOLDERING PASTE, ELECTRONIC PART DEVICE, ELECTRONIC CIRCUIT MODULE AND ELECTRONIC CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain a sealing material, a soldering flux and a soldering paste which can cope with increase in mounting density, miniaturization of parts and reduction in the distances between arranged parts while exhibiting a sufficient bonding strength and furthermore can improve thermal reliability of bonding between parts. SOLUTION: The sealing material comprises an adhesive resin, a curing agent and at least one kind of powder selected among inorganic powders and organic powders. Electronic parts, semiconductor chips or electronic circuit modules are bonded to part-mounting boards, chip-mounting boards or motherboards using this sealing material. Also provided are a soldering flux and a soldering paste having the same composition as the sealing material.