| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin having an excellent flame retardance and a prepreg, a laminate for printed wiring board, a semiconductor-sealing material as a well as a molding material using the resin. SOLUTION: In the resin syntbesized from a polyphenol, formaldehyde and an aromatic primary amine, which contains no halogen atom but a benzoxazine ring in the structure, the range of number average molecular weight is adjusted to 600 or more and 2,000 or less.
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