发明名称 |
Resin-molded unit including an electronic circuit component covered by a protective magnetic film |
摘要 |
A resin-molded unit (1) includes a semiconductor bear chip (2) arranged inside and sealed in an epoxy resin mold (3). The resin-molded unit is entirely covered with a magnetic loss film (5) as a high-frequency current suppressor. It is preferable that the magnetic loss film is made of a granular magnetic material. A plurality of lead frames (4) may be extended from the semiconductor bear chip to the outside through the epoxy resin mold. <IMAGE> |
申请公布号 |
EP1143518(A1) |
申请公布日期 |
2001.10.10 |
申请号 |
EP20010108513 |
申请日期 |
2001.04.04 |
申请人 |
TOKIN CORPORATION |
发明人 |
YOSHIDA, SHIGEYOSHI;ONO, HIROSHI |
分类号 |
B29C45/14;H01L21/56;H01L23/29;H01L23/31;H01L23/552;H01L23/58;H01L23/66;H05K9/00 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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