Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the same

摘要

A semiconductor device (30A) is provided, which device includes a semiconductor chip (32A) including external terminals (33) formed on a surface thereof and a sealing resin (35A) formed on the surface of the semiconductor chip (32A). A contaminant film (48) formed on the surface of said semiconductor chip (32A) has a laser-processed edge so that a peripheral portion of the surface of said semiconductor chip (32A) is bonded to the sealing resin (35A).