| 摘要 |
PROBLEM TO BE SOLVED: To provide a photo-curing paste composition with a good characteristic of filling crevices, an excellent photo-curing property and no possibility of generating a flake or a crack of a pattern during baking. SOLUTION: A photo-curing paste composition comprises (A) fine inorganic particles, (B) a binder polymer with no ethylenically unsaturated double bond, (C) a photo-curing compound and (D) a photopolymerization initiator. Preferably, the above (B) constituent dissolved in at least one kind of the above (C) constituent is used. And the above photo-curing compound (C) consists of a liquid mono- functional photo-curing compound with one ethylenically unsaturated double bond in one molecule and a multi-functinal photo-curing compound with more than one ethylenically unsaturated double bond in one molecule. The composition can be applied profitably to a method of forming inorganic baked patterns such as a partition pattern in PDP, FED, LCD or the like, an electrode (a conductor circuit) pattern, and a dielectric (resistor) pattern, using a groove (concave) part formed in a predetermined pattern. |
