| 摘要 |
PROBLEM TO BE SOLVED: To reduce disconnection defects of the contact hole of an active matrix substrate, having a resin layer formed thereon. SOLUTION: A method for manufacturing the active matrix substrate with the resin layer, having a stage for forming the photosensitive resin layer on the active matrix substrate, a stage for pattern-exposure of the photosensitive resin layer and a stage for developing the photosensitive resin layer to form a contact part in the resin layer is characterized, in that the ratio of monomer weight (M)/binder weight (B), respectively contained in the photosensitive resin layer, is equal to 0.85-1.3 and the ratio of the photopolymerization initiator weight (K)/the monomer weight (M) respectively contained in the photosensitive resin layer is equal to 0.04-0.18. |
