| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg for printed circuit board containing an inorganic base material and having high dielectric constant and excellent heat-resistance, electrical properties in moisture-absorbed state, adhesivity to copper foil, etc. SOLUTION: The objective prepreg having high dielectric constant is produced by using a B-stage sheet obtained from a resin composition containing 80-99 wt.% insulating inorganic filler powder having a dielectric constant of >=500 at room temperature, placing an inorganic base material at the center of the B-stage sheet and integrating the components. More particularly, the prepreg having high dielectric constant is produced by using a composition obtained by uniformly compounding an insulating inorganic filler having a dielectric constant of >=500 at room temperature and a specific surface area of 0.30-1.00 m2/g to a resin composition containing a thermosetting resin comprising (a) 100 pts.wt. of a polyfunctional cyanic acid ester compound and (b) 50-10,000 pts.wt. of an epoxy resin which is liquid at room temperature and adding 0.005-10 pts.wt. of a heat-curing catalyst to the resin based on 100 pts.wt. of the sum of the components (a) and (b). A high-density printed circuit board is produced by using the prepreg.
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